| Production
Capability: |
 Max.
Panel size : 250 mm x 400 mm , 500 mm x 500 mm |
| Min.
line width/space : 1.5/1.5 mil (S/S);
1.5/1.5 mil (D/S) |
| Min.
thickness of Cu : 1/3 oz |
| Layer
to Layer Registration : ± 4mil
(0.1 mm) |
| Min.
Via Pad : 12 mil (0.3 mm) |
| Min.
Via/ Drilling : 4 mil (0.1 mm)-Laser |
| Multi-layer
: 8 layers and above |
| Multi-layer+HDI:
8 layers and above + 2 levers blind/bury hole |
|
•Base
material : Polyimide (PI) |
•Surface
Finished : Hard Gold ,Immersion
Gold , HASL , Tin Lead Plating
Lead free Plating |
| •Cover
layer : PI , Ink , PSR |
| •Shielding
Material : EMI, Silver Paste ,Silver
Film. |
| .Stiffener : PI, PET , FR4 and Metal. |
| •Assembly
: SMT (0201) Including material preparation and electric testing. |
